Gpixel and Tower Semiconductor develop iToF sensor

Gpixel and Tower Semiconductor develop iToF sensor

Gpixel and Tower Semiconductor develop iToF sensor

Gpixel and Tower Semiconductor have announced that Gpixel’s indirect Time of Flight (iToF) sensor for 3D imaging, the GTOF0503, is being produced utilising Tower’s 65nm leading pixel-level stacked BSI CIS technology at its Uozo, Japan facility.

The sensor features a 5um 3-tap state-of-the-art iToF pixel incorporating a pixel array with a resolution of 640 x 480 pixels, and is targeting a broad range of fast-growing depth sensing and distance measurement applications in markets such as vision-guided robotics, bin picking, automated guided vehicles, automotive and factory automation applications.

According to Yole Development, the market is currently estimated at $4bn and is expected to grow to over $8bn by 2025.

Commenting on the release of the iToF sensor and its entering into the 3D imaging market, Wim Wuyts, Chief Commercial Officer, Gpixel said, that it was made possible by the company’s collaboration with Tower’s team.

“Tower’s vast expertise in development of iToF image sensor technology provided an outstanding platform for the design of this cutting-edge performing product. This collaboration produced a unique sensor product that is perfectly suited to serve a wide variety of fast-growing applications and sets a roadmap for future successful developments,” said Wuyts.

The GTOF0503 sensor combines a small, cost-effective footprint with industry-leading depth accuracy at short, mid and long-range distances. This allows for exceptional depth-sensing even in challenging ambient light conditions by using a pulse modulation iToF technique.

A demodulation contrast of > 80% is achieved with modulation frequencies of up to 165 MHz at either 60 depth frames per second (fps) in Single Modulation Frequency (SMF) or 30 fps in Dual Modulation Frequency (DMF) depth mode.

Advanced features such as integrated light source control, 2×2 and 4×4 digital binning, H/V image flipping, multiple ROI readout to boost fps, several supported acquisition modes, depth measurement with both single and dual frequency, low-power standby modes, and an industry-standard MIPI CSI-2 high-speed interface, enable versatile use and flexible operation, providing a cost-effective all-in solution suitable for a range of different applications..

The GTOF0503 is both available as bare die and in a 9 x 9 mm ceramic package and samples (bare die) and evaluation kits are now available.

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